Rogers 5880

Rogers 5880 (also known as RO4350B) is a high-frequency circuit material manufactured by Rogers Corporation. It features a low dielectric constant of 2.20 at 10GHz, ultra-low loss tangent of 0.0009, and excellent thermal stability, making it ideal for RF and microwave applications operating from MHz frequencies to millimeter-wave ranges (77GHz+). The material consists of PTFE composite with ceramic fillers, providing dimensional stability and consistent electrical properties.

Rogers 5880 has a dielectric constant (Dk) of 2.20 ±0.02 at 10GHz and 23°C. This low and stable dielectric constant ensures consistent electrical performance across a wide frequency range. The material also features excellent Dk stability with temperature (TCDk of +40 ppm/°C) and frequency, making it suitable for precision impedance-controlled circuits and broadband applications.

Rogers 5880 significantly outperforms FR4 in high-frequency applications. Key differences include: lower dielectric loss (0.0009 vs 0.02), better thermal stability, more consistent dielectric constant (2.20 vs 4.4 variable), superior performance above 1GHz, lower moisture absorption, and wider operating temperature range. While FR4 is cost-effective for general-purpose applications below 1GHz, Rogers 5880 is essential for RF, microwave, and millimeter-wave circuits where signal integrity and low loss are critical. The trade-off is higher material cost (3-5× more expensive) and specialized fabrication requirements.

Rogers 5880 is used extensively in: 5G wireless infrastructure and millimeter-wave systems (24-40GHz), satellite communications (Ka-band, Ku-band), automotive radar systems (77GHz collision avoidance), aerospace and defense radar, antenna systems and phased arrays, RF test and measurement equipment, wireless base station power amplifiers, microwave filters and passive components, low noise amplifiers for receivers, millimeter-wave point-to-point links, and high-frequency circuit prototyping. Any application requiring low loss, stable electrical properties, and operation above 5GHz benefits from Rogers 5880.

Rogers 5880 is available in various substrate thicknesses ranging from 0.005 inches (0.127mm) to 0.060 inches (1.524mm). Common standard thicknesses include 0.010" (0.254mm), 0.020" (0.508mm), 0.031" (0.787mm), 0.062" (1.575mm), and custom thicknesses can be ordered for specific applications. The choice of thickness depends on the application requirements, target impedance (50Ω or 75Ω being most common), frequency of operation, and power handling needs. Thinner substrates are preferred for higher frequencies and compact designs, while thicker substrates offer better power handling and mechanical strength.

To design a Rogers 5880 PCB: 1) Calculate trace widths using impedance calculators with Dk=2.20 and your chosen substrate thickness, 2) Use controlled impedance routing for all RF signal traces with constant width, 3) Implement solid ground planes with via stitching around RF traces (typically λ/10 spacing), 4) Maintain consistent trace spacing and avoid right-angle corners (use 45-degree or curved bends), 5) Consider thermal management with thermal vias for high-power components, 6) Use appropriate copper weights (typically 0.5oz to 2oz), 7) Apply microstrip or stripline transmission line configurations, 8) Perform electromagnetic simulation (HFSS, CST, ADS) to verify performance, and 9) Follow manufacturer design guidelines for layer stack-up and drilling specifications. Always specify impedance control requirements in fabrication documentation.

Rogers 5880 can operate effectively from DC (zero frequency) up to 77GHz and beyond into the millimeter-wave spectrum. Its low loss characteristics (dissipation factor of 0.0009) and stable dielectric properties make it suitable for extremely high-frequency applications including 5G New Radio bands (24-40GHz range), automotive radar at 77GHz, E-band point-to-point links (71-86GHz), and W-band systems. The practical frequency limit depends on the specific circuit design, substrate thickness, and fabrication quality, but Rogers 5880 has been successfully used in applications approaching 110GHz. For frequencies above 100GHz, specialized design techniques and very thin substrates are required.

Rogers 5880 typically costs 3-5 times more than standard FR4 material due to its specialized manufacturing process, proprietary material composition, and superior electrical properties. Raw material costs, specialized fabrication requirements (precise drilling, controlled impedance testing), lower production volumes, and quality control overhead all contribute to higher prices. However, for high-frequency applications above 1GHz, the performance benefits justify the additional cost through improved signal integrity, reduced insertion losses (50% lower than FR4), enhanced reliability, and better thermal stability. Cost optimization strategies include using hybrid stack-ups (Rogers 5880 + FR4), limiting Rogers material to critical RF layers only, and optimizing panel utilization to reduce waste.

Yes, Rogers 5880 can be effectively combined with FR4 in hybrid or mixed-dielectric stack-ups, offering a cost-effective solution for many applications. This approach uses Rogers 5880 for critical high-frequency signal layers (typically outer layers or specific internal RF layers) while using FR4 for non-critical power, ground, and low-frequency signal layers. Design considerations for hybrid stack-ups include: accounting for different thermal expansion coefficients (CTE mismatch), ensuring proper bonding between dissimilar materials using appropriate prepregs, managing impedance transitions between layer types, and considering fabrication complexity and yield. Hybrid designs can reduce total material costs by 30-50% while maintaining excellent RF performance where it matters most. Consult with your PCB fabricator early in the design process to ensure they have experience with mixed-material stack-ups.

Rogers 5880 offers excellent thermal properties for high-frequency applications: Thermal Coefficient of Dielectric Constant (TCDk) of +40 ppm/°C ensuring stable electrical performance across temperature variations, low Coefficient of Thermal Expansion (CTE) in the Z-axis of 24 ppm/°C for dimensional stability, operating temperature range from -55°C to +280°C suitable for extreme environments, thermal conductivity of 0.60 W/m/K for moderate heat dissipation, glass transition temperature (Tg) greater than 280°C preventing thermal degradation, and decomposition temperature above 425°C. These properties make Rogers 5880 suitable for aerospace applications, automotive under-hood environments, outdoor installations with wide temperature swings, and high-power RF circuits. For very high-power applications (>10W), consider additional thermal management such as thermal vias, heat sinks, or Rogers TMM series materials with higher thermal conductivity.